IEC/PAS 62169 Edition 1.0-2000 处理、包装、船用和潮湿/回流敏感表面固定装置的标准
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【英文标准名称】:Standardforhandling,packing,shippinganduseofmoisture/reflowsensitivesurfacemountdevices
【原文标准名称】:处理、包装、船用和潮湿/回流敏感表面固定装置的标准
【标准号】:IEC/PAS62169Edition1.0-2000
【标准状态】:现行
【国别】:国际
【发布日期】:2000-08
【实施或试行日期】:
【发布单位】:国际电工委员会(IEC)
【起草单位】:IEC/TC47
【标准类型】:()
【标准水平】:()
【中文主题词】:电子设备及元件;抗湿;搬运;表面安装;包装件;航运;电气工程;电子工程;半导体器件;表面安装设备
【英文主题词】:surfacemounting;shipping;packages;semiconductordevices;handling;moistureresistance;electronicequipmentandcomponents;electricalengineering;smd;electronicengineering
【摘要】:3.2Assemblyprocesses3.2.1Thisstandardappliestobulksolderreflowassemblybyconvection,convection/IR,infrared(IR),andvaporphasereflow(VPR)processes.Itdoesnotapplytobulksolderreflowprocessesthatimmersethecomponentbodiesinmoltensolder(e.g.,backsidewavesolder).SuchprocessesarenotallowedformanySMDsandarenotcoveredbythecomponentqualificationsstandardsusedasabasisforthisdocument.3.2.2Thisstandardalsoappliestomoisturesensitivecomponentsthatareremovedorattachedsinglybylocalambientheating,i.e.,“hotairrework.”3.2.3Thisstandarddoesnotapplytocomponentsthataresocketedandnotexposedtosolderreflowtemperatures.Suchcomponentsarenotatriskanddonotrequiremoistureprecautionaryhandling.3.2.4Thisstandarddoesnotapplytocomponentsinwhichonlytheleadsareheatedtoreflowthesolder,e.g.,hand-soldering,hotbarattachofgullwingleads,andpin-thru-holewithbacksidewavesolder.Theheatabsorbedbythepackagebodyfromsuchoperationsistypicallymuchlowerthanforbulksurfacemountrefloworhotairrework,andmoistureprecautionarymeasuresaretypicallynotneeded.3.3Reliability3.3.1Themethodssetforthinthisspecificationensurethatadequatecomponentreliability,asevaluatedandverifiedbyJ-STD-020and/orbyJESD22-A113plusenvironmentalreliabilitytesting,ismaintainedduringandafterthePCBassemblyoperation.3.3.2Thisspecificationdoesnotaddressorensuresolderjointreliabilityofattachedcomponents.
【中国标准分类号】:L15
【国际标准分类号】:31_080_01
【页数】:16P;A4
【正文语种】:英语
【原文标准名称】:处理、包装、船用和潮湿/回流敏感表面固定装置的标准
【标准号】:IEC/PAS62169Edition1.0-2000
【标准状态】:现行
【国别】:国际
【发布日期】:2000-08
【实施或试行日期】:
【发布单位】:国际电工委员会(IEC)
【起草单位】:IEC/TC47
【标准类型】:()
【标准水平】:()
【中文主题词】:电子设备及元件;抗湿;搬运;表面安装;包装件;航运;电气工程;电子工程;半导体器件;表面安装设备
【英文主题词】:surfacemounting;shipping;packages;semiconductordevices;handling;moistureresistance;electronicequipmentandcomponents;electricalengineering;smd;electronicengineering
【摘要】:3.2Assemblyprocesses3.2.1Thisstandardappliestobulksolderreflowassemblybyconvection,convection/IR,infrared(IR),andvaporphasereflow(VPR)processes.Itdoesnotapplytobulksolderreflowprocessesthatimmersethecomponentbodiesinmoltensolder(e.g.,backsidewavesolder).SuchprocessesarenotallowedformanySMDsandarenotcoveredbythecomponentqualificationsstandardsusedasabasisforthisdocument.3.2.2Thisstandardalsoappliestomoisturesensitivecomponentsthatareremovedorattachedsinglybylocalambientheating,i.e.,“hotairrework.”3.2.3Thisstandarddoesnotapplytocomponentsthataresocketedandnotexposedtosolderreflowtemperatures.Suchcomponentsarenotatriskanddonotrequiremoistureprecautionaryhandling.3.2.4Thisstandarddoesnotapplytocomponentsinwhichonlytheleadsareheatedtoreflowthesolder,e.g.,hand-soldering,hotbarattachofgullwingleads,andpin-thru-holewithbacksidewavesolder.Theheatabsorbedbythepackagebodyfromsuchoperationsistypicallymuchlowerthanforbulksurfacemountrefloworhotairrework,andmoistureprecautionarymeasuresaretypicallynotneeded.3.3Reliability3.3.1Themethodssetforthinthisspecificationensurethatadequatecomponentreliability,asevaluatedandverifiedbyJ-STD-020and/orbyJESD22-A113plusenvironmentalreliabilitytesting,ismaintainedduringandafterthePCBassemblyoperation.3.3.2Thisspecificationdoesnotaddressorensuresolderjointreliabilityofattachedcomponents.
【中国标准分类号】:L15
【国际标准分类号】:31_080_01
【页数】:16P;A4
【正文语种】:英语
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